Heat dissipation board - Company Ranking(10 companies in total)
Last Updated： Aggregation Period:Aug 27, 2025〜Sep 23, 2025
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Implementation Example】 [For Double-Sided Boards] ○ Board Thickness: 0.3mm ○ Insulation Layer Thickness: 0.06mm (Prepreg) ○ Minimum L/S... | 【Usage】 ○LED (package substrate, motherboard), power supply ●For more details, please contact us or download the catalog. | ||
| For more details, please refer to the PDF document or feel free to contact us. | For more details, please refer to the PDF document or feel free to contact us. | ||
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ダイワ工業
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- Featured Products
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Heat-dissipating substrate "DPGA"
- overview
- 【Implementation Example】 [For Double-Sided Boards] ○ Board Thickness: 0.3mm ○ Insulation Layer Thickness: 0.06mm (Prepreg) ○ Minimum L/S...
- Application/Performance example
- 【Usage】 ○LED (package substrate, motherboard), power supply ●For more details, please contact us or download the catalog.
Original DPGA (for high brightness and high heat dissipation LEDs)
- overview
- For more details, please refer to the PDF document or feel free to contact us.
- Application/Performance example
- For more details, please refer to the PDF document or feel free to contact us.
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ダイワ工業
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