Heat dissipation board - Company Ranking(6 companyies in total)
Last Updated： Aggregation Period:Jul 16, 2025〜Aug 12, 2025
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Implementation Example】 [For Double-Sided Boards] ○ Board Thickness: 0.3mm ○ Insulation Layer Thickness: 0.06mm (Prepreg) ○ Minimum L/S: 150μm/150μm ○ Minimum Via Land Diameter: 600μm ○ Minimum Via Land Pitch: 0.75mm [Metal (Copper) Base Board, Single-Sided, 1 Layer] ○ Copper Plate Thickness: 0.6–1.5mm ○ Insulation Layer Thickness: 0.06mm (Prepreg, High Thermal Conductivity Resin) ○ Minimum L/S: 125μm/125μm ○ Minimum Via Land Diameter: 450μm ○ Minimum Via Land Pitch: 0.575mm ● For more details, please contact us or download the catalog. | 【Usage】 ○LED (package substrate, motherboard), power supply ●For more details, please contact us or download the catalog. | ||
|
---
--- |
--- | ||
ダイワ工業
-
- Featured Products
-
Heat-dissipating substrate "DPGA"
- overview
- 【Implementation Example】 [For Double-Sided Boards] ○ Board Thickness: 0.3mm ○ Insulation Layer Thickness: 0.06mm (Prepreg) ○ Minimum L/S: 150μm/150μm ○ Minimum Via Land Diameter: 600μm ○ Minimum Via Land Pitch: 0.75mm [Metal (Copper) Base Board, Single-Sided, 1 Layer] ○ Copper Plate Thickness: 0.6–1.5mm ○ Insulation Layer Thickness: 0.06mm (Prepreg, High Thermal Conductivity Resin) ○ Minimum L/S: 125μm/125μm ○ Minimum Via Land Diameter: 450μm ○ Minimum Via Land Pitch: 0.575mm ● For more details, please contact us or download the catalog.
- Application/Performance example
- 【Usage】 ○LED (package substrate, motherboard), power supply ●For more details, please contact us or download the catalog.
-
ダイワ工業
Membership (free) is required to view all content.
Already a Member? Log In Here
