Heat dissipation board - 企業ランキング(全11社)
更新日： 集計期間:Oct 15, 2025〜Nov 11, 2025
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企業情報を表示
| 会社名 | 代表製品 | ||
|---|---|---|---|
| 製品画像・製品名・価格帯 | 概要 | 用途/実績例 | |
| By combining with high-precision machining technology, we can provide high thermal conductivity substrates suitable for high-density mountin... | Various module circuit boards (converter modules, RF modules) | ||
| For more details, please refer to the PDF document or feel free to contact us. | For more details, please refer to the PDF document or feel free to contact us. | ||
| By combining with high-precision machining technology, we can provide high thermal conductivity substrates suitable for high-density mountin... | Various module circuit boards (converter modules, RF modules) | ||
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モリマーエスエスピー 本社
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- 代表製品
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Heat-dissipating substrate "Thick Copper Special Substrate"
- 概要
- By combining with high-precision machining technology, we can provide high thermal conductivity substrates suitable for high-density mountin...
- 用途/実績例
- Various module circuit boards (converter modules, RF modules)
Heat dissipation substrate "Heat dissipation Via"
- 概要
- For more details, please refer to the PDF document or feel free to contact us.
- 用途/実績例
- For more details, please refer to the PDF document or feel free to contact us.
Heat-dissipating substrate "Thick Copper Special Substrate"
- 概要
- By combining with high-precision machining technology, we can provide high thermal conductivity substrates suitable for high-density mountin...
- 用途/実績例
- Various module circuit boards (converter modules, RF modules)
-
モリマーエスエスピー 本社
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